Glass substrate and TGV
Glass substrates are essential in advanced semiconductor packaging, including glass interposers with fine-pitch, high-aspect-ratio TGVs and glass cores with larger vias in thicker glass layers. Accurate inspection of these structures is critical to ensure product reliability. However, conventional tools often struggle to inspect internal features deeply buried inside the glass — especially tiny cracks or rough surfaces that may lead to failures. Holotomography captures the full 3D structure of vias and surrounding glass non-destructively. It can visualize internal features, sidewalls, subsurface cracks, and even provide cross-sectional images similar to observing a physical cut, without damaging the sample — regardless of via size, depth, or glass thickness (up to 2 mm).
Features
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- Full 3D Via Imaging
- Capture the entire 3D structure of vias, including depth, sidewalls, and bottom.
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- Crack Detection
- Detect internal micro-cracks inside the glass
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- Aspect Ratio Independent
- Accurately measure both narrow, deep vias and wide, shallow vias.
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- Deep Glass Inspection
- Non-destructive 3D imaging up to 2 mm glass thickness.
Discover Glass substrate and TGV with HT
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Laser Modification Analysis
Visualize laser-modified zones by detecting micro-cracks, refractive index changes, and unprocessed areas. Enables easy optimization of laser conditions when changing materials, etchants, or after equipment maintenance.
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Optimized Etching Process Control
Visualize laser-modified zones by detecting micro-cracks, refractive index changes, and unprocessed areas. Enables easy optimization of laser conditions when changing materials, etchants, or after equipment maintenance.
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Enhanced AOI Inspection Support
Quantitatively analyze the full via profile — including top, middle, and bottom diameters — and measure sidewall roughness. Enables optimization of etching parameters such as etchant concentration, temperature, and time to maintain consistent via shape and surface quality.
