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Glass substrates and TGV
TGV sidewall roughness, quantified in 3D — without cutting the panel
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PICs and Waveguide
Buried waveguide shape and refractive index, mapped in 3D — non-destructively
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Advanced packaging
Cu pad recess and bonding-interface roughness, before yield loss happens
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Micro display
Pixel-level layer thickness uniformity across a micro display
| Application | Recommended system · key measurements |
|---|---|
| Glass substrate and TGV | HT-T1™ (transmission) — laser-modified zone imaging, via 3D profile, sidewall roughness, microcrack detection |
| PICs and Waveguide | HT-T1™ (transmission) — buried waveguide shape & refractive-index distribution, laser-written structure analysis |
| Advanced packaging | HT-R1™ (reflection) — Cu pad recess depth, bonding-interface roughness, RDL 3D critical dimensions |
| Micro display | HT-R1™ (reflection) — thin-film thickness, pixel structure, optical coating uniformity |
New here? See How Holotomography Works for a plain-language introduction, or jump straight to a free sample measurement.