Tomocube

Beyond the surface-level information of conventional tools that provide only surface-level information, HT-R1™ offers true 3D imaging of surface topography and, in transparent layers, internal structure. No cutting, polishing, or physical contact is required. This allows repeated inspection of valuable or delicate samples without the risk of damage or contamination. Manufacturers can monitor product quality at any stage of production, confidently identifying internal defects or irregularities that may affect product performance. The ability to observe the full internal structure, layer by layer, ensures greater confidence in process control and long-term product reliability.

Traditional high-precision inspection methods often require long scanning times, limiting their practicality for fast-moving production environments. The HT-R1™’s full-field 3D data acquisition rapidly covers large areas in a fraction of the time, making it highly effective for inline inspection, process monitoring, and real-time quality assurance—without sacrificing accuracy.

In advanced packaging processes such as hybrid bonding, complex structures often include thin transparent dielectric layers positioned alongside metal features. Traditional optical inspection tools struggle with such configurations because differences in material properties cause variations in reflected light phase, and underlying structures beneath the transparent layers introduce further interference. The HT-R1™ addresses these challenges with reflection-based holotomography, accurately separating and visualizing both metallic and transparent regions—even in multilayer stacks with complex subsurface patterns. This enables precise control and verification of critical structures that are otherwise extremely difficult to inspect with conventional methods.

Despite operating in the visible light range, the HT-R1™ achieves 130 nm lateral resolution, enabling critical-dimension (CD) analysis at submicron scales below the reach of conventional optical inspection. This allows for precise analysis of fine features and narrow line widths at submicron scales, which are increasingly common in advanced semiconductor and packaging processes. Manufacturers can now perform high-resolution dimensional measurements without resorting to slower or destructive methods.